DOWSIL™ TC-3035 S Thermal Gel

Qué es DOWSIL™ TC-3035 S Thermal Gel?

One-part, pink, 4.0 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as communication base stations, smart phones, and memory chips. DOWSIL™ TC-3035 S Thermal Gel is a room temperature cure product with accelerated heat cure that is ultra soft and has a long working time.

Usos

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

Beneficios

Thermal conductivity: 4.0 W/mK
Room temperature or heat-accelerated cure
Cure time: 30 days at 25 °C, 30 min at 80 °C
Hardness: 65 Shore 000
Long working time

Propiedades

typical.properties.Title
Color	Pink
Cure Type	Heat accelerated cure
Durometer - Shore 000	65
Heat Cure	30 min @ 80 °C
Material Type	Gap Filler / Gel
Number of Parts	1 part
Specific Gravity	3.2
Thermal Conductivity	4 W/m・K

DOWSIL™ TC-3035 S Thermal Gel

Qué es DOWSIL™ TC-3035 S Thermal Gel?

Usos

Beneficios

Propiedades

typical.properties.Title

RESOURCES

EDUCATION

CORPORATE

LEGAL