DOWSIL™ TC-3015 Re-workable Thermal Gel

Qué es DOWSIL™ TC-3015 Re-workable Thermal Gel?

One part, heat cure silicone-based thermally conductive gel for thermal management of smartphone components with good re-workability. It can be cured to elastic pad with certain tensile strength and elongation which can make sure that the material can be peeled off easily and completely without residue in rework process.

Usos

Printable or dispensable gel to replace fabricated pad
Thermal interface material used for smartphone CPU and memory chips
Dispensed or screen printed to various thickness and shapes for general thermal

Beneficios

Re-workable
Can be cured at room temperature or accelerated cure at 60°C or higher temperature for shorter curing time
Cures to a soft thermal gel for thermal transferring, stress relieving and shock damping
Resists humidity and other harsh environments without cracking and slumping
Low volatile content

Propiedades

typical.properties.Title
Color	Pink
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	72
Heat Cure	480 min @ 60 °C , 60 min @ 100 °C
Material Type	Gap Filler / Gel
Number of Parts	1 part
Specific Gravity	2.6
Thermal Conductivity	2 W/m・K

DOWSIL™ TC-3015 Re-workable Thermal Gel

Qué es DOWSIL™ TC-3015 Re-workable Thermal Gel?

Usos

Beneficios

Propiedades

typical.properties.Title

RECURSOS

EDUCACIÓN

CORPORATIVO

LEGAL