DOWSIL™ SE 4485 Thermally Conductive Adhesive

O que é DOWSIL™ SE 4485 Thermally Conductive Adhesive?

A one-part, white, moisture cure RTV thermal conductivity silicone adhesive for efficient thermal transfer in the cooling of electronics modules.

DOWSIL™ SE 4485 Thermally Conductive Adhesive is designed to provide efficient thermal transfer for the cooling of modules, including lamp, telecom, and power supply devices

typical.properties.Title
Color	White
Cure Type	Moisture cure, Room temperature cure
Durometer - Shore A	90
Material Type	Adhesive
Number of Parts	1 part
Specific Gravity	2.9
Tensile Strength in MPa	3.4 MPa
Thermal Conductivity	2.8 W/m・K