DOWSIL™ TC-5026 Thermally Conductive Compound

O que é DOWSIL™ TC-5026 Thermally Conductive Compound?

One-part, gray, 2.9 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as bare die, insulated-gate bipolar transistors (IGBT), and electric vehicles (EV). DOWSIL™ TC-5026 Thermally Conductive Compound is non-curing, with low thermal resistance.

Usos

Minimizing thermal resistance
Thermal interface material (TIM)

Benefícios

Thermal conductivity: 2.9 W/mK
Thermal resistance: 0.04 °C-cm2/W @ 7 µm gap
Formulated to achieve ultra-thin bond lines at low pressure
High stability and reliability
Easy application – screen and stencil-printable
Solvent-free formulation

Propriedades

typical.properties.Title
Bond-line Thickness at 40 psi	7 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	3.5
Thermal Conductivity	2.9 W/m・K
Thermal Resistance at 40 psi	0.03 Deg C-cm2/W

DOWSIL™ TC-5026 Thermally Conductive Compound

O que é DOWSIL™ TC-5026 Thermally Conductive Compound?

Usos

Benefícios

Propriedades

typical.properties.Title

RECURSOS

EDUCAÇÃO

EMPRESARIAL

JURÍDICO