DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler

什么 DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler?

Two-part, blue, 2.0 W/mK thermally conductive gap filler formulated to dissipate heat in electronics applications, such as electric vechicle (EV) battery and power modules. DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler is a low-density product, intended for high volume applications.

用途

Heat dissipation
Vibration damping
Stress relief
Thermal interface material (TIM)

优势

Thermal conductivity: 2.0 W/mK
Room temperature or heat-accelerated cure
Cure time: 6 hr at 25 °C, 30 min at 80 °C
Hardness: 65 Shore 00
Specific Gravity: 1.95
Easy to rework after curing and assembly
Soft, compliant, and stress-relieving

性能

product.use.formulating.properties.Title
Mixing Ratio	1:1 wt%
Room Temperature Cure	6 Hours

typical.properties.Title
Color	Blue
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	65
Heat Cure	30 min @ 80 °C
Material Type	Gap Filler / Gel
Number of Parts	2 part
Specific Gravity	2
Thermal Conductivity	2 W/m・K

DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler

什么 DOWSIL™ TC-5515 LT Low Density Thermal Conductive Gap Filler?

用途

优势

性能

product.use.formulating.properties.Title

typical.properties.Title

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