DOWSIL™ TC-5550 Thermal Conductive Compound

什么 DOWSIL™ TC-5550 Thermal Conductive Compound?

A high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance.

用途

Lidless GPU
d-GPU, FPGA, or ASIC chips for Consumer, Computing and Telecommunication application

优势

Good pump-out resistance for bare die application
High thixotropy index(> 14)and solvent free formulation
Screen and stencil printable
High thermal conductivity: 5.0W/mk
Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
Low thermal resistance: 0.04 °C-cm2/W at 40 psi

Web of icons such as wifi, smartphone, robotics and cloud over a cityscape.

DOWSIL™ TC-5121 导热硅脂

推出新的DOWSIL™ TC-5550导热化合物——为应对下一代电子技术中的高性能材料挑战而打造。这种创新的有机硅润滑脂可代替 PCM 或热垫片使用，专为免光模和无盖 CPU 设计，提供高泵出阻力和高通量。

观看视频

性能

typical.properties.Title
Bond-line Thickness at 40 psi	20 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	2.6
Thermal Conductivity	5 W/m・K
Thermal Resistance at 40 psi	0.05 Deg C-cm2/W

DOWSIL™ TC-5550 Thermal Conductive Compound

什么 DOWSIL™ TC-5550 Thermal Conductive Compound?

用途

优势

DOWSIL™ TC-5121 导热硅脂

性能

typical.properties.Title

资源

教育

公司

法律