DOWSIL™ TC-5550 Thermal Conductive Compound

什么 DOWSIL™ TC-5550 Thermal Conductive Compound?

One-part, gray, 5.0 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as bare die, graphics processing units (GPU), field programmable gate arrays (FPGA), and application-specific integrated circuit (ASIC) chips. DOWSIL™ TC-5550 Thermal Conductive Compound is non-curing, with low thermal resistance.

用途

Minimizing thermal resistance
Thermal interface material (TIM)

优势

Thermal conductivity: 5.0 W/mK
Thermal resistance: 0.05 °C-cm2/W @ 20 µm gap
Easily prints on heat sink or GPU
No added solvent or process aid
Stable performance – no pump-out after thermal cycling
Easy to clean; good reworkability

Web of icons such as wifi, smartphone, robotics and cloud over a cityscape.

DOWSIL™ TC-5121 导热硅脂

推出新的DOWSIL™ TC-5550导热化合物——为应对下一代电子技术中的高性能材料挑战而打造。这种创新的有机硅润滑脂可代替 PCM 或热垫片使用，专为免光模和无盖 CPU 设计，提供高泵出阻力和高通量。

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性能

typical.properties.Title
Bond-line Thickness at 40 psi	20 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	2.6
Thermal Conductivity	5 W/m・K
Thermal Resistance at 40 psi	0.05 Deg C-cm2/W

DOWSIL™ TC-5550 Thermal Conductive Compound

什么 DOWSIL™ TC-5550 Thermal Conductive Compound?

用途

优势

DOWSIL™ TC-5121 导热硅脂

性能

typical.properties.Title

资源

教育

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