とは DOWSIL™ 3-6385 Thermally Conductive Encapsulant Kit?
Two part, 1:1 mix ratio, red, room temperature or fast heat curing, thermally conductive silicone encapsulant.
用途
- Potting of high voltage transformers and sensors
利点
- Designed to protect against mositure, environmental attack, mechanical and thermal shock as well as vibration especially where heat transfer is important and high hardness or high specific gravity of the product is required
- Two part, 1:1 mixing ratio
- Room temperature cure or rapid heat cure
- Addition cure systems: no cure by-products
- Stable and flexible from -50°C to +200°C