物性
アプリケーションの利点 |
|
|---|---|
| Use | Boards and Assemblies, Components |
製品の使用と処方 |
|
|---|---|
| Number of Parts | One Part No Mixing |
代表的な物性 |
|
|---|---|
| Color | Clear |
| Cure Type | Heat Cure |
| Dielectric Constant at 100 kHz | 2.90 |
| Dielectric Strength | 533 volts per mil v/mil |
| Heat Cure | 15 min @ 125°C, 10 min @ 150°C |
| Opacity | Transparent |
| Penetration after cure | 80 |
| Specific Gravity @ 25°C | 0.97 |
| Thermal Conductivity | 0.15 W/m・K |
| Viscosity | 690 mPa.s |