物性
app.properties.Title |
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Temperature Range | -40 to 185 °C |
Use | Boards and Assemblies, Components |
cert.standards.properties.Title |
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Regulatory Approvals | UL Recognized |
product.use.formulating.properties.Title |
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Number of Parts | Two Part |
Working Time | > 240 Minutes |
typical.properties.Title |
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Cure Type | Heat Cure |
Dielectric Constant at 100 kHz | 2.9 |
Dielectric Constant at 1MHz | 2.9 |
Dielectric Strength | 559 volts per mil v/mil |
Dielectric Strength (kV/mm) | 22 kV/mm |
Dissipation Factor at 100 kHz | 4.6e-005 |
Heat Cure | 10 Minutes @ 100 Deg C, 30 Minutes @ 70 Deg C, 5 Minutes @ 150 Deg C |
Mixing Viscosity | 520 Centipoise |
Opacity | Translucent |
Volume Resistivity | 2e+015 Ω・cm |