物性
app.properties.Title |
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|---|---|
| Use | Boards and Assemblies, Components |
cert.standards.properties.Title |
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|---|---|
| Regulatory Approvals | IPC-CC-830B, MIL Spec, UL Recognized |
product.use.formulating.properties.Title |
|
|---|---|
| Cure Type | Addition Cure |
| Number of Parts | One Part |
typical.properties.Title |
|
|---|---|
| Color | Transparent |
| Cure Type | Heat accelerated cure |
| Dielectric Constant at 100 Hz | 2.85 |
| Dielectric Strength | 575 volts per mil v/mil |
| Dispense Method | Dip, Spray |
| Dissipation Factor at 100 Hz | 0.00271 |
| Dissipation Factor at 100 kHz | < 0.0003 |
| Durometer - Shore A | 0-50 |
| Heat Cure | 10 Minutes @ 100 Deg C |
| Shear | 130 psi |
| Solvent | No |
| Viscosity | <2000 mPa.s |
| Volume Resistivity | 2.11e+014 Ω・cm |