Two-part, 1 to 1 mix ratio, room temperature of heat cure, low viscosity silicone dielectric gel that is suitable for sealing and protecting various electronic devices, especially those with delicate components.
用途
Sealing and protection of delicate electronic circuits
Hybrid devices
Sealing of small appliances
利点
General purpose
Low viscosity
Room temperature cure or rapid heat cure
Addition cure system: no cure by-products
Self-healing gel
Permanent pressure sensitive adhesion to most materials without use of a primer
Stable and flexible from -50°C to +200°C
Clear
Excellent dielectric properties
Long term sealing against moisture and atmospheric contaminants