FAQ: Reduce Bubbles, Conformal Coating
FAQ: Reduce Bubbles, Conformal Coating
Application guidelines:
- Keep the material as close to the substrate as possible when applying to help reduce bubbles and entrapped air.
- Minimize length material needs to travel and pressure required to dispense
- Minimize time the material is pressurized, do not keep material pressurized when not in use.
- Use bladder packs or other barriers (i.e., a plunger or follower plate) between pressure and material to help minimize air incorporation.
If using heat to reduce the time required to reach a tack-free state, allow adequate time for the solvent to evaporate prior to exposing to elevated temperatures in an air circulating oven.
A typical cure schedule for 3 mil (75 micron) coatings (like the DOWSIL™ 3-1953 Conformal Coating and other room temperature cure DOWSIL™ conformal coatings) is 10 minutes at room temperature, followed by 10 minutes at 60°C.
If the silicone coating blisters or contains bubbles, allow additional time at room temperature for the solvent to flash off prior to oven cure.
Dow Electronics Protection & Assembly Academy - Lab Series -Vacuum Deairing
This video describes methods to mitigate bubble and void formation in silicone products. The process of vacuum deairing and its benefit to the deairing process is described.
The most common contaminate is going to be flux residues, either “no-Clean” or traditional.
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