Conductive Materials

Thermally conductive adhesives are suitable for bonding and sealing hybrid circuit substrates, semiconductor components, heat spreaders and other applications that demand broad design, flexible processing options and excellent thermal management. One part moisture-cure grades offer simple room-temperature processing to minimize costs. One or two-art heat cure solutions help to accelerate processing to speed time to market.  

Thermally conductive compounds, commonly called greases, serve as a thermal bridge that draws heat away from a device’s sensitive electronic components and dissipates it into the ambient environment. These no-cure materials offer relatively low cost, ease of application on heat sinks via screen rating and ease of rework.  

Thermally conductive encapsulants and gels come in a wide range of adaptable products for encapsulation and potting applications. The low viscosity before cure of these products enables them to process easily and fully embed tall components, delicate wires and solder joints. They are particularly suitable for managing high heat in complicated electronic module component architectures.

Our dispensable thermal pads enable you to quickly and precisely dispense or print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrate shapes, helping to ensure excellent thermal management and lower cost of ownership compared to prefabricated thermal pads. 

Thermally conductive gap fillers are easy-to-use, soft, compressible, stress-relieving and vibration-damping materials with minimal process preparation requirements. They offer excellent long-term durability in application, maintain low-stress interfacial contact and feature thixotropic characteristics that benefit processability and vertical hold stability. Gap fillers are an excellent choice for applications with large gap tolerances (typically 150 μm to 2 mm).