Row of neon-colored spoons and forks laid out on a white background

​Food Grade Molds​

Increase productivity, extend equipment life and reduce waste with silicone release agents

Silicone release agents from Dow contain nonstick properties that enable quick release of products made in molds and provide lubricity and slipperiness in applications such as conveyor belts. These agents also find use in food-contact manufacturing processes in a variety of applications, from release agents for plastic cutlery and cups to mold release agents for baking.

Benefits of using silicone release agents 

Faster throughput 
Cleaner finished products 
Less material waste 
Longer life of the mold or machinery  

Get the silicone advantage

Trust the beneficial properties of silicone release agents for your application:

Lower surface tension than most polymers
Higher heat stability than organic alternatives
Superior oxidation resistance characteristics
Lower use rates than organics

Ensure compliance

Silicone release agents from Dow recommended for food processing or packaging applications have been reviewed for compliance with relevant dietary laws and regional regulations.

Note that products only carry such certifications when bearing the approved compliance symbols.

Colorful plastic spoons and forks isolated white background; Shutterstock ID 179638148

When compliance meets performance

Discover what can happen when compliance meets performance – and learn about Dow’s latest silicone innovation DOWSIL™ 8024 Food Contact Release Emulsion.

DOWSIL™ 8024 Food Contact Release Emulsion

Stable, water-dilutable silicone release emulsion for the food processing industry, delivering efficient mold release action and complying with major global and regional industry regulations. Typical release applications include plastic cutlery and cups, as mold release agent for tortilla processing and/or as a mold release agent for bakery.

Speak to an expert

We are committed to connecting you with experts and resources to tackle any challenge.