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MEMS Sensors and Actuator Solutions
Silicone solutions for MEMS and advanced semiconductors
As microelectronics become ever smaller, thinner and more complex, requirements for stress management, durability and reliability grow more challenging.
Dow silicone hybrids, hotmelts and die-attach film solutions can help optimize designs for MEMS and advanced semiconductor packaging, drive new innovations and meet stringent performance requirements, including thermal stress relaxation, stability over broad temperature and frequency ranges, low moisture uptake, high purity and reliability. Dow’s silicone-based materials address all these needs more effectively than organics such as epoxies and polyurethanes.
Optimize designs for MEMS and advanced semiconductor packaging
Drive new innovations and meet stringent performance requirements
Address needs more effectively than organics such as epoxies and polyurethanes
Dow’s newest silicone solutions for MEMS and semiconductor packaging
Die Attach Film
Die-attach films, are cured silicone films, offering excellent uniformity for precise thickness and eliminating fillets and bleed-out that commonly occur with epoxy adhesives. Die-attach applications target for typical semiconductor package, especially for MEMS sensors.
Novel Silicone Hybrid Adhesives
Silicone hybrid adhesives combine silicone and organics in a unique formulation, delivering enhanced mechanical properties that silicone alone can’t achieve, such as higher modulus and strong adhesion to various surfaces. They also feature excellent optical properties and non-yellowing for light post to reliability for light module applications.
Silicone Hotmelt
Silicone hot melt, offered in film, cartridge and tablet formats, provide excellent adhesion to a variety of substrates, as well as stress relief for warpage mitigation. Excellent for semiconductor processing as mold-underfill, soft mold and encapsulation.
Silicone hybrids, hotmelts and die-attach film solutions
Explore our portfolio of silicone hybrids, hotmelts and die-attach film solutions for MEMS and advanced semiconductor packaging.
DOWSIL™ Silicone Hot-Melt Film Technology
Learn about the advantages of DOWSIL™ Silicone Hot-Melt Film vs. liquid silicone, including a quicker, easier process and reduced thermal stress.
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