The pressure is on electronics and device manufacturers to streamline production and maximize the reliability of their products.

Offering a versatile, cost-effective alternative to pre-fabricated thermal pads, this innovative technology from Dow enables manufacturers to quickly and precisely print a thermally conductive silicone compound in controllable thicknesses on complex substrates. In addition to accelerating manufacturing cycles, this can help reduce material costs by 30 to 60 percent by eliminating the waste more common to conventional fabricated thermal pads.

Dispensable thermal pads are compatible with a wide range of efficient application processes, including standard screen or stencil printing, or via standard dispensing equipment. Once cured, they provide robust product performance by protecting against impact, shock and thermal cycling.

Our portfolio of dispensable thermal pads encompasses a range of products, distinguished by varying levels of thermal conductivity, from 1.5 to 2.5 W/mK. Additional selections incorporate glass beads to offer improved control over bond line thickness.

All products are compatible with common substrates like aluminum and printed circuit boards. They eliminate the fiberglass carrier used for conventional fabricated pads, dispensable thermal pads offer lower thermal resistance, excellent compression and consistently reliable, high-quality thermal management over the product lifetime.