Energy Conversion

In potting solutions, our silicone encapsulants contribute to lower PCB system assembly costs by eliminating the pre-heating step required for polyurethanes. For even faster filling, we offer simple room-temperature cure materials with the option of reducing cure time to 20 minutes at temperatures of 50°F. 

In the field, our solventless and low VOC conformal coatings solutions protect high value electronics from the changes in season, harsh sun and other environmental assaults that impose repetitive thermal cycling and mechanical stress. Unlike acrylic options, our silicones process easily without residual moisture that extends cycle times and compromises coating quality. 

For unprimed adhesion to a variety of substrates, our silicone adhesives and sealants offer simple room temperature cure with the option to accelerate cure time. They hold up to repeated exposure to strong electrical fields, extremes in humidity and temperatures ranging from -45° to 200°C. 

To moderate internal heat, we offer a growing portfolio of thermally conductive adhesives, encapsulants and dispensable thermal pads designed to withstand increases in heat resulting from electronics that operate at higher power densities and frequencies.