Silicone Pressure Sensitive Adhesive Coating and Curing
Discover silicone solutions
Silicone pressure sensitive adhesives (PSAs) have stability and flexibility that is unmatched by organic PSAs. Discover why silicone PSAs can best meet your diverse application needs.
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| Silicone PSA | Organic PSA | ||
Type (Cure/Material) | Addition | BPO | Acrylic | Rubber |
Heat Resistance | 200°C | 200°C | 150°C | 100°C |
Low Temp, Resistance | -50°C | -50°C | 0°C | 0°C |
Weather Resistance | Excellent | Excellent | Good | Poor |
Adhesion to PTFE | High | High | Poor | Poor |
Adhesion to Si Rubber | Middle to High | High | Poor | Poor |
*Comparison for reference only with typical material testing under specific conditions.
Explore the potential
Gain insights into how our high-performance line of silicone pressure sensitive adhesives (PSAs) can be adapted to your needs and enhance your applications.
Substrates for Silicone PSAs:
- Glass
- Teflon film
- Paper
- Mylar PET film
- Fabric
- Kapton polyimide film
- Plastics
- Glass cloth
- Silicone rubber
- PTFE (polytetrafluoroethylene)
- Silicone-varnished cloth
- FEP (fluorinated ethylene propylene)
- Silicone/glass laminates
- Aluminum foil
- Polyester
- Stainless steel
Key curing considerations
Whatever your application needs are, Dow’s globally trusted pressure sensitive adhesives (PSAs) will help you achieve your most challenging design goals. Read more to discover which cure system will provide you with the best results.
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| Peroxide Cure | Platinum Cure |
Curing Temperature | High Temperatures | Low Temperatures |
High Temperature Properties | Very Good | Good |
Track and Adhesion | Good | Superior |
Priming | Recommended | Not Required |
Properties Formulation and Condition Dependency | Both | Poor |
Easily Poisoned | No | Yes |
- Requires the addition of a platinum catalyst to develop PSA properties
- Coating bath should be used within six hours of catalyst addition
- Adhesives can be cured in vented, continuous coating ovens at low temperatures (80°C, 176°F)
- On flexible substrates, typical cure speeds range from 1 minute at 125°C (257°F) to 2 minutes at 100°C (212°F)
- Changing the catalyst level has little impact on the tack, adhesion or cohesive strength of the cured adhesive
- A benzoyl peroxide catalyst is typically used to develop PSA properties
- Most consistent results are achieved by using 98% benzoyl peroxide; and a complete blending of peroxide and adhesive is best obtained through a 10% solution of peroxide in toluene
- Coating bath should be used a day after mixing, as peroxide loses its activity quite rapidly in solvent
- Peroxide concentration can be varied from 0.5% to 3.0% (based on adhesive solids)
- Increasing peroxide concentration will decrease tack and adhesive strength, but increase cohesive strength of the cured coating
- Mixing is necessary to achieve uniform results in the finished product
- Curing the adhesive is a two-step process that requires the use of graded temperatures
- To ensure proper curing, solvent removal is need after applying the adhesive to the backing material
- Recommended temperatures range from 65°C to 93°C (150 to 200°F)
- Higher removal temperatures can cause the peroxide to decompose and crosslink the solvent into the adhesive
- After the solvent is removed, a tacky, uniform film of adhesive is left on the backing
- Heat curing can further strengthen the film’s adhesiveness and cohesiveness
- The amount of cure depends on several factors, including the type of catalyst, equipment and backing material
- The evaporation of volatile silicone in the curing oven can cause the formation of oven dust
- Two possible ways to reduce this problem: Select a silicone PSA with lower volatile silicone conten
- Use ramped oven zones (oven zones with temperatures that get progressively hotter)
- For the manufacture of self-wound tapes or laminate constructions with backings such as polyester, Kapton®, Teflon® and other plastic films, the use of a primer may be required to improve anchorage of the cured adhesive to the backing
- Good anchorage reduces the possibility of adhesive transfer during unwind and ensures clean slitting operations and clean removability following masking
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