DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

What is DOWSIL™ EE-3200 Low Stress Silicone Encapsulant?

Has a very low hardness and viscosity to minimize internal stress generation, fill small gaps, and improve manufacturing speed for complex and high volume electronic devices.

Uses

Desined for protection of Power Conversion Devices (Inverters, Converters), Junction Boxes, Automotive PCB Modules, Railways PCB Systems

Benefits

Low modulus reduces pressure on components
Thermal conductivity effectively dissipates heat
Good mechanical adhesion avoids delamination issues
Fast cure and optimized working time allows for more complex designs and lower module cost
Dielectric strength and volume resistivity reduce costs as no additional dielectric barrier is required
Ease of use – low viscosity allows fast fill and fit with high throughput manufacturing processes
Minimal filler settling allows for ease of process control
Meets certification requirements

Properties

app.properties.Title
Use	Boards and Assemblies, Components

cert.standards.properties.Title
Regulatory Approvals	UL Recognized

product.use.formulating.properties.Title
Number of Parts	Two Part
Room Temperature Cure	3 Hours
Working Time at 25°C	30 Minutes

typical.properties.Title
Color	Dark Grey to Black
Cure Type	Heat Cure, Room Temperature Cure
Dielectric Strength	350 volts per mil v/mil
Durometer - Shore 00	21
Heat Cure	20 min @ 50°C
Opacity	Opaque
Specific Gravity @ 25°C	1.48
Thermal Conductivity	0.50 W/m・K
Viscosity	1700 mPa.s

DOWSIL™ EE-3200 Low Stress Silicone Encapsulant

What is DOWSIL™ EE-3200 Low Stress Silicone Encapsulant?

Uses

Benefits

Properties

app.properties.Title

cert.standards.properties.Title

product.use.formulating.properties.Title

typical.properties.Title

RESOURCES

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