DOWSIL™ TC-3035 Reworkable Thermal Gel

What is DOWSIL™ TC-3035 Reworkable Thermal Gel?

4w/mk thermal interface material for smartphone application. Dispensable and reworkable to replace thermal pad and thermal putty.

One-part
4.0W/mk thermally conductive gel
Re-workable
High Extrusion rate
Room temperature cure or elevated temperature cure (at 60°C or higher) for fast cure
Cures to soft gel for thermal transferring, stress relieving and shock damping
Resists heat, humidity and other harsh environments without cracking or slumping
Can be dispensed or screen printed to various thickness and shapes for thermal management

typical.properties.Title
Color	Pink
Cure Type	Heat accelerated cure, Room temperature cure
Durometer - Shore 00	75
Heat Cure	30 min @ 80 °C
Material Type	Gap Filler / Gel
Number of Parts	1 part
Specific Gravity	3.2
Thermal Conductivity	4 W/m・K