DOWSIL™ TC-4525 A/B

What is DOWSIL™ TC-4525 A/B?

A thermally Conductive Gap Filler offers thermal conductivity of 2.5W/m.K. This is a soft and compressible silicone material designed to dissipate heat from electronic modules by conducting it to a heat sink such as an aluminum housing. Excellent fit for automotive electronics and battery packs applications.

Uses

Designed to dissipate the heat from components mounted on printed circuit board to heat sink providing a reliable cooling solution for modules like an engine or transmission control unit

Benefits

Improved reliability in harsh temperatures – Effectively dissipate heat away from sensitive components. They withstand peak exposure at 200°C, and perform reliably at operating temperatures ranging up to 150°C.
Easy processing – These advanced thermally conductive materials dispense easily from their original packaging with minimal to no additional process preparation, making them well-suited for automated application using standard meter mix equipment.
Effective assembly – Avoid slumping on vertical surfaces during assembly. After cure, they maintain their vertical stability even after long use.
Cost-effective, fast cure – The platinum cure system enables fast, controlled cure at room temperature, although cure times can be accelerated further with heat to reduce manufacturing cycle times. No post-cure steps are required.
UL 94 V-0 recognition – Received recognition under Underwriters Laboratories UL 94 standard, which evaluates the flammability of plastic and silicone materials intended for parts in devices and appliances. Recognition under UL 94 is a step toward applying the UL label on your final product.

Gap filler application

Watch as bdtronic dispenses DOWSIL™ TC-4525 Thermally Conductive Gap Filler at various speeds, patterns and thicknesses.

WATCH HERE

Properties

app.properties.Title
Use	Battery Pack, Boards and Assemblies, Components

product.use.formulating.properties.Title
Number of Parts	Two Part

typical.properties.Title
Color - Part A	White
Dielectric Constant at 1MHz	6.6
Durometer - Shore 00	55
Heat Cure	10 Minutes @ 80 Deg C, 120 Minutes @ 25 Deg C, 20 Minutes @ 50 Deg C
Material Type	Gap Filler
Shelf Life	300 Days
Specific Gravity	2.9
Thermal Conductivity	2.6 W/m・K
Volume Resistivity	2.4e+014 Ω・cm

DOWSIL™ TC-4525 A/B

What is DOWSIL™ TC-4525 A/B?

Uses

Benefits

Gap filler application

Properties

app.properties.Title

product.use.formulating.properties.Title

typical.properties.Title

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