DOWSIL™ TC-5550 Thermal Conductive Compound

What is DOWSIL™ TC-5550 Thermal Conductive Compound?

One-part, gray, 5.0 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as bare die, graphics processing units (GPU), field programmable gate arrays (FPGA), and application-specific integrated circuit (ASIC) chips. DOWSIL™ TC-5550 Thermal Conductive Compound is non-curing, with low thermal resistance.

Uses

Minimizing thermal resistance
Thermal interface material (TIM)

Benefits

Thermal conductivity: 5.0 W/mK
Thermal resistance: 0.05 °C-cm2/W @ 20 µm gap
Easily prints on heat sink or GPU
No added solvent or process aid
Stable performance – no pump-out after thermal cycling
Easy to clean; good reworkability

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DOWSIL™ TC-5550 Thermally Conductive Compound

Introducing new DOWSIL™ TC-5550 Thermally Conductive Compound - created for the high-performance materials challenges in next-generation electronics technology. This innovative silicone grease can be used in place of a PCM or thermal pad, and was designed for bare die and lidless CPUs, providing high pump-out resistance and high-throughput.

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Properties

typical.properties.Title
Bond-line Thickness at 40 psi	20 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	2.6
Thermal Conductivity	5 W/m・K
Thermal Resistance at 40 psi	0.05 Deg C-cm2/W

DOWSIL™ TC-5550 Thermal Conductive Compound

What is DOWSIL™ TC-5550 Thermal Conductive Compound?

Uses

Benefits

DOWSIL™ TC-5550 Thermally Conductive Compound

Properties

typical.properties.Title

RESOURCES

EDUCATION

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