DOWSIL™ TC-5550 Thermal Conductive Compound

What is DOWSIL™ TC-5550 Thermal Conductive Compound?

A high thermal conductivity (5.0W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT(0.02mm) thermal grease that is especially designed for bare die architecture to provide long term reliability with excellent pump-out resistance performance.

Uses

Lidless GPU
d-GPU, FPGA, or ASIC chips for Consumer, Computing and Telecommunication application

Benefits

Good pump-out resistance for bare die application
High thixotropy index(> 14)and solvent free formulation
Screen and stencil printable
High thermal conductivity: 5.0W/mk
Achieves thin Bond Line Thickness (BLT): 0.02mm at 40 psi
Low thermal resistance: 0.04 °C-cm2/W at 40 psi

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DOWSIL™ TC-5550 Thermally Conductive Compound

Introducing new DOWSIL™ TC-5550 Thermally Conductive Compound - created for the high-performance materials challenges in next-generation electronics technology. This innovative silicone grease can be used in place of a PCM or thermal pad, and was designed for bare die and lidless CPUs, providing high pump-out resistance and high-throughput.

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Properties

typical.properties.Title
Bond-line Thickness at 40 psi	20 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	2.6
Thermal Conductivity	5 W/m・K
Thermal Resistance at 40 psi	0.05 Deg C-cm2/W

DOWSIL™ TC-5550 Thermal Conductive Compound

What is DOWSIL™ TC-5550 Thermal Conductive Compound?

Uses

Benefits

DOWSIL™ TC-5550 Thermally Conductive Compound

Properties

typical.properties.Title

RESOURCES

EDUCATION

CORPORATE

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