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Introducing new DOWSIL™ TC-5550 Thermally Conductive Compound - created for the high-performance materials challenges in next-generation electronics technology. This innovative silicone grease can be used in place of a PCM or thermal pad, and was designed for bare die and lidless CPUs, providing high pump-out resistance and high-throughput.
typical.properties.Title |
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|---|---|
| Bond-line Thickness at 40 psi | 20 um (Microns) |
| Color | Gray |
| Cure Type | No cure |
| Material Type | Compounds and Greases |
| Number of Parts | 1 part |
| Specific Gravity | 2.6 |
| Thermal Conductivity | 5 W/m・K |
| Thermal Resistance at 40 psi | 0.05 Deg C-cm2/W |