DOWSIL™ TC-5860 Thermally Conductive Compound

What is DOWSIL™ TC-5860 Thermally Conductive Compound?

One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in electronics applications, such as photovoltaic (PV) inverters, energy storage systems, and high-power modules. DOWSIL™ TC-5860 Thermally Conductive Compound is non-curing, with good stability during aging.

Uses

Minimizing thermal resistance
Thermal interface material (TIM)

Benefits

Thermal conductivity: 6.0 W/mK
Thermal resistance: 0.11 °C-cm2/W @ 40 µm gap
Solvent-free formulation
Easy application
High dielectric strength >8kV/mm
Good stability during aging
Suitable for use in high-power electronics

Back view of solar panel. Inverter to transform direct current into alternate

Harness Renewable Energy with DOWSIL™ TC-5860 Conductive Compound

Dow has developed a solution for high heat dissipation and high reliability for PV inverters. DOWSIL™ TC-5860 Thermally Conductive Compound provides PV inverters with long term reliable thermal management and performance helping to enable the global energy transition.

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Properties

typical.properties.Title
Bond-line Thickness at 40 psi	70 um (Microns)
Color	Gray
Cure Type	No cure
Material Type	Compounds and Greases
Number of Parts	1 part
Specific Gravity	3.5
Thermal Conductivity	6 W/m・K
Thermal Resistance at 40 psi	0.11 Deg C-cm2/W

DOWSIL™ TC-5860 Thermally Conductive Compound

What is DOWSIL™ TC-5860 Thermally Conductive Compound?

Uses

Benefits

Harness Renewable Energy with DOWSIL™ TC-5860 Conductive Compound

Properties

typical.properties.Title

RESOURCES

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