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What is DOWSIL™ TC-5960 Thermally Conductive Compound?
Provides high thermal conductivity, low pump-out and high-temperature stability, designed to provide efficient thermal transfer for the cooling of electronic modules, and good pump-out resistance especially in bare die application.
Uses
- Designed to provide efficient thermal transfer for the cooling of electronic modules
- Good pump-out resistance especially in bare die application
Benefits
- Excellent pump-out resistance for bare die application
- High thixotropy • One part material – no cure required
- Solvent free formulation – provides material stability
- Easy application – screen and stencil printable
- High thermal conductivity
- Low thermal resistance
- Achieves thin Bond Line Thickness (BLT)Text