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What is DOWSIL™ TC-5960 Thermally Conductive Compound?
One-part, gray, 6.0 W/mK thermally conductive compound formulated to dissipate heat in bare die electronics applications. DOWSIL™ TC-5960 Thermally Conductive Compound is non-curing, with low thermal resistance.
Uses
- Minimizing thermal resistance
- Thermal interface material (TIM)
Benefits
- Thermal conductivity: 6.0 W/mK
- Thermal resistance: 0.03 °C-cm2/W @ 16 µm gap
- Excellent pump-out resistance for bare die application
- High thixotropy – index of 9
- One-part material – no cure required
- Solvent-free formulation – offers material stability
- Easy application – screen- and stencil-printable